منابع مشابه
Modern Electronic Packaging Technology
A view of modern electronic packaging technology is presented along with its applications at APL. Although not always distinct, electronic packaging may be separated into three levels: component, board, and system. The manufacturing technologies and designs may vary at each level, but they all must provide electrical interconnection, thermal management, and mechanical and environmental protecti...
متن کاملSemiconductor Packaging Assembly Technology
This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board (PCB). Another function is to provide the desired mechanical and environmental protection to ensure reliability and performance. Three fundamental assembly flow processes ...
متن کاملReliability challenges in 3D IC packaging technology
0026-2714/$ see front matter 2010 Elsevier Ltd. A doi:10.1016/j.microrel.2010.09.031 E-mail address: [email protected] At the moment, a major paradigm change, from 2D IC to 3D IC, is occurring in microelectronic industry. Joule heating is serious in 3D IC, and vertical interconnect is the critical element to be developed. Also reliability concerns will be extremely important. For example, in order ...
متن کاملA Review of 3-D Packaging Technology
This paper reviews the state-of-the-art in threedimensional (3-D) packaging technology for very large scale integration (VLSI). A number of bare dice and multichip module (MCM) stacking technologies are emerging to meet the ever increasing demands for low power consumption, low weight and compact portable systems. Vertical interconnect techniques are reviewed in details. Technical issues such a...
متن کاملThe Application of Plasma Technology in Packaging
Throughout recent years the idea to use plasma technology to modify materials has been at the forefront. The use of plasma to sterilize packaging has become increasingly popular. Plasma has also been adopted to surface treat materials, increasing their wettability. This opens a wide variety of doors; anywhere from better printing, to bonding unlike materials during dual-injection molding. Lastl...
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ژورنال
عنوان ژورنال: Journal of SHM
سال: 1993
ISSN: 1884-1198,0919-4398
DOI: 10.5104/jiep1993.9.2_18